CPU: Intel® Core™ Celeron/I5/I7/Xeon Processor (Skylake and Kaby Lake)
CPU Choice: Celeron G3900TE, i5-6500TE, i7-6700TE, Xeon E3-1268L v5 (Socket LGA1151) Celeron G3930TE, i5-7500T, i7-7700T
Chipset: Intel® Q170 Sunrise Point
RAM: Up to 32GB DDR4-2133 SoDIMM


LAN: 4x GbLAN (1x Intel 219, 3x i210)
Graphic: 2x DP 1.2 (4096x2304 @ 60Hz; Supports DVI/HDMI)
USB: USB 4x 3.0
COM: No external COM
PSU Input: PSU onboard, wide range, galvanically isolated, DC input
 Internal-Connectors (SBC onboard)
LAN: No additional LAN
Graphic: No additional Graphic
USB: No additional USB
Storage: No additional SATA-Connector
Storage: 2x Storage Expansion: SATA M.2 Key-B 2280
Serial COM: No additional COM
Audio: 2x HD Audio (DP/HDMI)
I/O Expansion: No additional I/O
PCIe Expansion: 8 Lanes PCIe 3.0 by BA Edge Connect
GPIO: No additional GPIO
Security: additional Security by fTPM and M.2 Crypto Module/SSD
Temp Std.:  -20° to +70°C
Temp Ext.:  -40° to +85°C (option upon request)
PSU Input: Single Voltage, wide range 20-30VDC (24V Nominal) Optional 12-24V; 20-36V
PSU Features: galvanically isolated
Dimension: 120mm x 120mm (2.9" x 2.9")
Weight: tbd. gr. (w/o thermal solution)



The CB6464 is one of the latest in Beckhoff’s line of high-performance, compact 120mm x 120mm SBC based on 6th/7th Generation Intel® Core™ and Celeron® processors. Featuring Intel Q170 chipset, it is a full-featured SBC with robust I/O including USB 3.0, LAN, M.2 PCIe/SATA and wide operating temperature range (-40C to 85C) and high-resolution DisplayPort outputs. Eight PCIe X1 expansion lanes allow for customization for any application-specific environment.

This makes it ideal for a variety of system-critical industrial applications where these high-performance features are an absolute necessity, but no less critical are less tangible features like high MTBF, long-life availability, hardware and firmware revision control, obsolescence management, technical, engineering and design support.


Secure Networking, Secure Routing, Traffic Monitoring and Gateways, Cyber Security Edge Devices for ICS and SCADA threat security, Unmanned and Drone Payload Computing, Industrial IoT Gateways and Controllers, Mobile Telephony, Traffic Engineering, Transportation, Wind Turbine Datalogging and Collision Avoidance, Oil and Gas IPC.

Please contact your sales representative for more information

Ordering Information

Item Codes Part# Description
CB6464 tbd. Board only!
Socket LGA1151
Supports max, 65W class CPU
CPU-Option to be ordered separately!
Intel i7-7700T tbd. Intel® Core™ i7-7700TE Processor (8M Cache, up to 3.80 GHz)
Intel i5-7500T tbd. Intel® Core™ i5-7500TE Processor (6M Cache, up to 3.30 GHz)
Intel G3930TE tbd. Intel® Celeron® Processor G3930TE (2M Cache, 2.70 GHz), Intel® HD Graphics 610
Intel Xeon E3-1268L tbd. Intel® Xeon™ E3-1268L v5 Processor (8M Cache, up to 3.40 GHz)
Intel i7-6700TE tbd. Intel® Core™ i7-6700TE Processor (8M Cache, up to 3.40 GHz)
Intel i5-6500TE tbd. Intel® Core™ i5-6500TE Processor (6M Cache, up to 3.30 GHz)
Intel G3900TE tbd. Intel® Celeron® Processor G3900TE (2M Cache, 2.30 GHz), Intel® HD Graphics 510
DDR4-DRAM4096 tbd. 4GB DDR4 DRAM 2133MHZ
DDR4-DRAM8192 tbd. 8GB DDR4 DRAM 2133MHZ
DDR4-DRAM16384 tbd. 16GB DDR4 DRAM 2133MHZ
DDR4-DRAM4096EX tbd. 4GB DDR4 DRAM-EX 2133MHZ -40°C TO +85°C
DDR4-DRAM8192EX tbd. 8GB DDR4 DRAM-EX 2133MHZ -40°C TO +85°C
DDR4-DRAM16384EX tbd. 16GB DDR4 DRAM-EX 2133MHZ -40°C TO +85°C
Thermal solutions    
Heatsink Set tbd. Heatsink-Set
for CPU (including PCH and VRM Heatsink)
Fan Set tbd. Fan-Set for Heatsink
(including small parts for mounting)
ET-SCREENING 290000 Extended Temperature Screening (–40C to +85C)
UNDERFILL 807707 BGA underfill req’d for <1nm BGA solderballs w/ Ext Temp
COATING 807706 Conformal Coating
UNDERFILL/BONDING/COATING 807709 Underfilling, Bonding, and Conformal Coating