Features
| CPU: | Intel® Core™ Celeron/I5/I7/Xeon Processor (Skylake and Kaby Lake) |
| CPU Choice: | Celeron G3900TE, i5-6500TE, i7-6700TE, Xeon E3-1268L v5 (Socket LGA1151) Celeron G3930TE, i5-7500T, i7-7700T |
| Chipset: | Intel® Q170 Sunrise Point |
| RAM: | Up to 32GB DDR4-2133 SoDIMM |
| Frontpanal-Connectors | |
| LAN: | 4x GbLAN (1x Intel 219, 3x i210) |
| Graphic: | 2x DP 1.2 (4096x2304 @ 60Hz; Supports DVI/HDMI) |
| USB: | USB 4x 3.0 |
| COM: | No external COM |
| PSU Input: | PSU onboard, wide range, galvanically isolated, DC input |
| Internal-Connectors (SBC onboard) | |
| LAN: | No additional LAN |
| Graphic: | No additional Graphic |
| USB: | No additional USB |
| Storage: | No additional SATA-Connector |
| Storage: | 2x Storage Expansion: SATA M.2 Key-B 2280 |
| Serial COM: | No additional COM |
| Audio: | 2x HD Audio (DP/HDMI) |
| I/O Expansion: | No additional I/O |
| PCIe Expansion: | 8 Lanes PCIe 3.0 by BA Edge Connect |
| GPIO: | No additional GPIO |
| Security: | additional Security by fTPM and M.2 Crypto Module/SSD |
| Temp Std.: | -20° to +70°C |
| Temp Ext.: | -40° to +85°C (option upon request) |
| PSU Input: | Single Voltage, wide range 20-30VDC (24V Nominal) Optional 12-24V; 20-36V |
| PSU Features: | galvanically isolated |
| Dimension: | 120mm x 120mm (2.9" x 2.9") |
| Weight: | tbd. gr. (w/o thermal solution) |
Description
The CB6464 is one of the latest in Beckhoff’s line of high-performance, compact 120mm x 120mm SBC based on 6th/7th Generation Intel® Core™ and Celeron® processors. Featuring Intel Q170 chipset, it is a full-featured SBC with robust I/O including USB 3.0, LAN, M.2 PCIe/SATA and wide operating temperature range (-40C to 85C) and high-resolution DisplayPort outputs. Eight PCIe X1 expansion lanes allow for customization for any application-specific environment.
This makes it ideal for a variety of system-critical industrial applications where these high-performance features are an absolute necessity, but no less critical are less tangible features like high MTBF, long-life availability, hardware and firmware revision control, obsolescence management, technical, engineering and design support.
Applications
Secure Networking, Secure Routing, Traffic Monitoring and Gateways, Cyber Security Edge Devices for ICS and SCADA threat security, Unmanned and Drone Payload Computing, Industrial IoT Gateways and Controllers, Mobile Telephony, Traffic Engineering, Transportation, Wind Turbine Datalogging and Collision Avoidance, Oil and Gas IPC.
Please contact your sales representative for more information
sales@adl-europe.com
Ordering Information
| Item Codes | Part# | Description |
|---|---|---|
| CPU-Board | ||
| CB6464 | tbd. | Board only! Socket LGA1151 Supports max, 65W class CPU CPU-Option to be ordered separately! |
| CPU-Option | ||
| Intel i7-7700T | tbd. | Intel® Core™ i7-7700TE Processor (8M Cache, up to 3.80 GHz) |
| Intel i5-7500T | tbd. | Intel® Core™ i5-7500TE Processor (6M Cache, up to 3.30 GHz) |
| Intel G3930TE | tbd. | Intel® Celeron® Processor G3930TE (2M Cache, 2.70 GHz), Intel® HD Graphics 610 |
| Intel Xeon E3-1268L | tbd. | Intel® Xeon™ E3-1268L v5 Processor (8M Cache, up to 3.40 GHz) |
| Intel i7-6700TE | tbd. | Intel® Core™ i7-6700TE Processor (8M Cache, up to 3.40 GHz) |
| Intel i5-6500TE | tbd. | Intel® Core™ i5-6500TE Processor (6M Cache, up to 3.30 GHz) |
| Intel G3900TE | tbd. | Intel® Celeron® Processor G3900TE (2M Cache, 2.30 GHz), Intel® HD Graphics 510 |
| Memories | ||
| DDR4-DRAM4096 | tbd. | 4GB DDR4 DRAM 2133MHZ |
| DDR4-DRAM8192 | tbd. | 8GB DDR4 DRAM 2133MHZ |
| DDR4-DRAM16384 | tbd. | 16GB DDR4 DRAM 2133MHZ |
| DDR4-DRAM4096EX | tbd. | 4GB DDR4 DRAM-EX 2133MHZ -40°C TO +85°C |
| DDR4-DRAM8192EX | tbd. | 8GB DDR4 DRAM-EX 2133MHZ -40°C TO +85°C |
| DDR4-DRAM16384EX | tbd. | 16GB DDR4 DRAM-EX 2133MHZ -40°C TO +85°C |
| Thermal solutions | ||
| Heatsink Set | tbd. | Heatsink-Set for CPU (including PCH and VRM Heatsink) |
| Fan Set | tbd. | Fan-Set for Heatsink (including small parts for mounting) |
| Options | ||
| ET-SCREENING | 290000 | Extended Temperature Screening (–40C to +85C) |
| UNDERFILL | 807707 | BGA underfill req’d for <1nm BGA solderballs w/ Ext Temp |
| COATING | 807706 | Conformal Coating |
| UNDERFILL/BONDING/COATING | 807709 | Underfilling, Bonding, and Conformal Coating |