Features
CPU: | Intel® Atom™ E3800 Processor (Bay Trail) |
CPU Choice: | Dual Core E3827, Quad Core E3845 (Single Core E3815 option upon request) |
Chipset: | Intel® SoC |
RAM: | Up to 8GB DDR3L 1333MHz |
Frontpanal-Connectors | |
LAN: | 3x GbLAN Intel i210 |
Graphic: | DVI 1920x1080 @ 60Hz 24bpp; Supports VGA/CRT |
USB: | USB 4x 2.0 |
COM: | No external COM |
PSU Input: | PSU onboard wide range DC input |
Internal-Connectors (SBC onboard) | |
LAN: | No additional LAN |
Graphic: | 1x DVI/HDMI/DP via I-PEX Option |
USB: | 1x USB3.0 via I-PEX Option |
Storage: | 1x SATA (3Gb/s) |
Storage: | 1x SATA Storage Expansion: 1x M.2 Key-B 2242 |
Serial COM: | No internal COM |
Audio: | 1x HD Audio (DP/HDMI) |
I/O Expansion: | 1x M.2 2280 Key-B 1x PCIeX1 (Gen. 2.0) |
PCIe Expansion: | No additional PCIe |
GPIO: | No additional GPIO |
TPM: | No additional TPM |
Temp Std.: | -20° to +70°C |
Temp Ext.: | -40° to +85°C (option upon request) |
PSU DC Input: | Single Voltage, wide range 20-30V (24V Nominal) Optional 7-36V |
PSU Features: | S-UPS (option upon request) |
SBC Formfactor | 3.5"-SBC |
Dimension: | 102mm x 147mm (4" x 5.8") |
Weight: | 120gr |
Description
The ADLE3800HDC is based on Intel’s first System-on-Chip (SoC) E3800-series Atom processors which use Intel’s 22nm 3D Tri-gate process. It offers vastly superior compute performance and energy efficiency and Intel’s 7th generation graphics engine for stunning graphics performance. Improved power management capabilities result in standby power measured in milliwatts with days of standby time. The ADLE3800HDC is a lower I/O, lower cost version of the ADLE3800HD offering M.2 (Type B) 2242 SATA storage and M.2 (Type B) 2280 PCIex1 expansion.Its high-performance graphics engine is capable of decoding 10 or more streams of 1080p video, has integrated hardware acceleration for video decode of H.264, MVC, VPG8, VC1/WMV9 and others standards. Display capabilities include: VGA/CRT = 2560×1600@60Hz 24bpp (via DVI conn), DVI/HDMI/DP (via I-PEX conn), DVI = 1920×1080@60Hz 24bpp, DirectX 11, Open GL 4.0, Full HD Video Playback, and DualDisplay Support. The ADLE3800HDC features a thermal junction temperature (Tj) of -40C to +85C and is ideal for a variety of intelligent controller or gateway applications in harsh extended temperature environments.
Please contact your sales representative for more information
sales@adl-europe.com
Ordering Information
Item Codes | Part# | Description |
---|---|---|
CPU-Boards | ||
ADLE3800HDC-E3845 | 294810 | Intel E3845; QC, 1.91 GHz, 2MB, 10W TDP |
ADLE3800HDC-E3827 | 294812 | Intel E3827; DC, 1.75 GHz, 1MB, 8W TDP |
Memories | ||
DDR3L-DRAM4096-(V) | 997600 | 4GB DDR3L DRAM 1600MHZ (V) |
DDR3L-DRAM8192-(V) | 997601 | 8GB DDR3L DRAM 1600MHZ (V) |
DDR3L-DRAM4096-EX-(V) | 997602 | 4GB DDR3L DRAM-EX 1600MHZ (V) -40°C TO +85°C |
DDR3L-DRAM8192-EX-(V) | 997604 | 8GB DDR3L DRAM-EX 1600MHZ (V) -40°C TO +85°C |
Thermal solutions | ||
ADLE3800HDC-SPREADER | 294865 | heat spreader for chassis mount ADLE3800HDC |
ADL35-BBHS | 294152 | large heat sink for ADLXXXHD CPU's |
ADL35-LFAN | 294154 | large fan for ADL35-BBHS |
ADL35-SOSET | 294156 | stand off set for ADL35-BBHS & LFAN |
CS-100 | 290010 | 10"x10" thermal chassis simulator for development |
Options | ||
ADL-ET | 290000 | Extended Temperature Screening (–40C to +85C) |
UNDERFILL | 807707 | BGA underfill req’d for <1nm BGA solderballs w/ Ext Temp |
COATING | 807706 | Conformal Coating |
UNDERFILL/BONDING/COATING | 807709 | Underfilling, Bonding, and Conformal Coating |