CPU: Intel® Atom™ E3900 Processor (Apollo Lake)
CPU Choice: Quad Core (x5-E3940), Dual Core (x5-E3930)
Chipset: Intel® SoC
RAM: Up to 8GB LPDDR4 soldered
LAN: 2x GbLAN (Intel)
Graphic: DisplayPort 2K/4K (Supports DVI/HDMI)
USB: USB 2x 3.0
COM: No external COM
PSU Input: PSU onboard (galvanic isolated) wide range DC input
Internal-Connectors (SBC onboard)
LAN: No additional LAN
Graphic: No additional Graphic
USB: 2x USB 2.0 by BA vertical Edge-Connect (muliplexed with SATA and PCIe)
Storage: 2x SATA 6Gb/s by BA vertical Edge-Connect (muliplexed with USB and PCIe)
Storage: 1x SATA Storage Expansion: M.2 Key-B 2242
Serial COM: No additional COM
Audio: 1x HD Audio (DP/HDMI)
I/O Expansion: No additional I/O
PCIe Expansion: 2x PCIe X1 2.0 by BA vertical Edge-Connect (muliplexed with USB and SATA)
GPIO: No additional GPIO
TPM: fTPM 2.0
Temp Std.:  -20° to +70°C
Temp Ext.:  -40° to +85°C (option upon request)
PSU Input: Galvanic Isolated, Single Voltage, Wide Range 20-30VDC (24VDC Nominal) Optional 7-36VDC
PSU Features: Optional: Beckhoff OCT PSU Feature
Dimension: 75mm x 75mm (2.9" x 2.9")
Weight: approx. 60gr



Measuring only 75 x 75mm, the CB6273 is the second generation embedded SBC optimized for size, weight and power (SWAP) applications. Based on the Intel Atom™ SoC E3900 series, this tiny board offers maximum performance in the smallest possible size. It features up to quad-core x86 processors with 2MB cache and an integrated Intel HD graphics 505 engine of the 9th generation with support for DirectX 12, Open GL 4.4, OpenCL 2.0 and hardware-accelerated UHD video playback with H.265/HEVC, VC-1, WMV9 and VP9.

About the Beckhoff Edge-Connect "vertical" Architecture:

In contrast to the "horizontal" expandability via L-Peripherals, which Beckhoff has already very successfully introduced and used, the "vertical" expansion standard now builds above the CPU board. This means that the very compact form factor of the single board computer is not increased.

The rear edge connector provides easy access to additional I/Os for standard and custom breakout boards. This simple expansion helps to reduce cabling, integration time and system size, while increasing quality and overall MTBF. Connection to sensors, cameras and memories is easy with a variety of onboard I/Os: 2x Gigabit LAN, 1x USB 3.0, 1x USB 2.0, 2x PCie and SATA. The Intel HD graphics engine outputs video via the DisplayPort (optionally via adapter also HDMI/DVI). An integrated M.2 socket enables the user to install the fastest solid state storage solutions on the market. The fix mounted edge-connect design coupled with soldered-on memory makes the CB6273ideal for rugged embedded applications in extended temperature range as well as shock and vibration.

ADL  vertical edge connect technology


UAV and UUV Unmanned Systems, Industrial Control Systems, Government and Defense, Video Surveillance, Small Scale Robotics, Remote Datalogging, Man-Wearable Computing

Please contact your sales representative for more information:

Ordering Information

Item Codes Part# Description
CB6273 V1 tbd. Intel x5-E3930 Atom Processor; Dual Core, 2x 1.3 GHz, 2MB Cache, 6,5W TDP, 4GB RAM soldered
CB6273 V4 tbd Intel x5-E3940 Atom Processor; Quad Core, 4x 1.6 GHz, 2MB Cache, 9,5W TDP, 8GB RAM soldered
Thermal solutions    
CB6273-LP-Spreader tbd. Low-Profile Heat Spreader CB6273
ET-SCREENING 290000 Extended Temperature Screening (–40C to +85C)
UNDERFILL 807707 BGA underfill req’d for <1nm BGA solderballs w/ Ext Temp
COATING 807706 Conformal Coating
UNDERFILL/BONDING/COATING 807709 Underfilling, Bonding, and Conformal Coating